Ƙaddamar da Processor Initiative (EIP), wani shiri na Tarayyar Turai na goyon bayan ƙasashen Turai don haɓaka na'urori masu sarrafawa na Turai, ya kammala kashi na farko. Wannan lokaci ya haɗa da haɓaka na'ura mai sarrafa Rhea na tushen Arm, fasahar tsaro don HPC da masu sarrafa gefen gefe da kuma hujja-na ra'ayi don guntu gwajin Processor Accelerator (EPAC).
A wani lokaci a yanzu, Turai tana son haɓaka na'urorin sarrafa na'urorinta da masana'antar da ke da alaƙa, ta yadda yankin ya rage dogaro da na'urori daga sauran yankuna na duniya. Don haka, kamfanoni da ƙungiyoyi na Turai 28 daga ƙasashe goma sun kafa ƙungiyar Processor Initiative (EIP). Ƙungiyar Tarayyar Turai (EU) kuma tana tallafawa wannan haɗin gwiwa.
Kwanan nan kungiyar ta sanar da cewa ta kammala matakin farko na ci gaba. Dangane da kasafin kudin Euro miliyan 79, kamfanoni daban-daban na Turai da masu farawa sun yi aiki kan haɓaka fasahar sarrafa nasu.
Sakamako kashi na farko na ci gaba
Babban nasarori daga wannan matakin sun haɗa da gabatarwar SiPearl's Arm Neoverse V1 na tushen Rhea processor tare da haɗin gwiwa tare da Atos. Duk da cewa fasahar Arm ta fito ne daga Burtaniya, wannan na'ura kuma tana da nau'ikan RISC-V masu buɗewa guda 29 waɗanda ke aiki azaman masu sarrafawa. Amfani da fasahar buɗaɗɗen tushe wani muhimmin sashi ne na yunƙurin na'ura mai sarrafa na Turai. A cikin 2023, ya kamata a fitar da wannan na'ura mai sarrafa 'Turai' a cikin mahallin sarrafa kwamfuta.
Wani sakamakon aikin EIP shine haɓaka fasahar tsaro ga HPC da kwamfutocin gefen. Abubuwan da ake kira 'crypto tiles' yanzu an ƙirƙira su don wannan dalili. Dole ne wannan fasaha ta haɗa kai tare da wasu mafita da aikace-aikace masu sarrafa tushen tushen budewa.
Sauran hanyoyin
Bugu da ƙari, Ƙwararrun Processor Accelerator (EPAC) gwajin guntu tabbacin ra'ayi an ƙirƙira shi a farkon matakin EIP. Cibiyar Supercomputing ta Barcelona da Jami'ar Zagreb (Croatia) sun haɓaka abin da ake kira na'urori masu sarrafa vector don babban aikin kwamfuta da ƙarancin amfani da makamashi. Wannan bayani ya dogara ne akan Avispado RISC-V core daga Semidynamics daga Barcelona.
Wannan aikin kuma ya ba da tabbacin ra'ayi don ginanniyar dandali na lissafi, a hade tare da SDK, don masana'antar kera motoci.
Mataki na 2 zai fara a 2022
Za a fara kashi na biyu na EIP a shekara ta 2022. A wannan lokaci, ƙungiyar tana son mayar da hankali musamman wajen kawo na'urorin da aka haɓaka a mataki na 1 zuwa samarwa.